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Proto-Advantage PA0002 SOIC-8 to DIP-8 Adapter 1.27mm Pitch 300mil-0

Proto-Advantage PA0002 SOIC-8 to DIP-8 Adapter 1.27mm Pitch 300mil

Original price was: $99.00.Current price is: $95.04.
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Test Socket Chip Quik PA-SOCKET-SOICW-20-1.27 for SOIC-20W 1.27mm IC

Original price was: $99.00.Current price is: $95.04.
Test Socket Chip Quik PA-SOCKET-SOICW-20-1.27 for SOIC-20W 1.27mm IC-0

Yamaichi IC Test & Burn-in Socket IC51-0804-795 for QFP80 0.65mm Pitch

Original price was: $126.40.Current price is: $99.92.

The Yamaichi IC Test and Burnin Socket IC51-0804-795 is engineered for QFP80, TQFP80, FQFP80 and PQFP80 packages, offering a precise 0.65 mm pitch for reliable connections. Its high‑quality construction provides durability during intensive test and burn‑in processes, making it ideal for industrial electronics manufacturing and repair. Easy to install, it ensures consistent performance and reduces downtime.

9999 in stock
SKU: CJNHJJB07BKX Category:
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Description

Product Overview

The Yamaichi IC Test and Burn‑in Socket model IC51-0804-795 is a premium‑grade component designed specifically for high‑density QFP family packages, including QFP80, TQFP80, FQFP80, and PQFP80 variants. Crafted from a robust copper alloy with a gold‑plated contact surface, this socket delivers exceptional conductivity and resistance to oxidation, ensuring a stable electrical interface throughout prolonged testing cycles. The 0.65 mm pitch aligns precisely with industry standards, allowing seamless integration into automated test equipment and manual burn‑in rigs. Each socket undergoes rigorous quality control, including continuity testing and mechanical stress verification, to guarantee that every unit meets the stringent reliability requirements of industrial and scientific applications. The compact form factor, combined with a low‑profile design, facilitates easy placement on printed circuit boards without compromising clearance or thermal performance.

[Product front view showing all components]

Usage

Designed for a broad range of environments, this socket excels in both laboratory and production line settings. Engineers and technicians employ it during functional verification, thermal cycling, and extended burn‑in procedures where consistent contact pressure is critical. Its durability makes it suitable for high‑temperature solder reflow processes, as well as for repeated insertion and removal cycles common in prototype development. The socket’s compatibility with multiple QFP package types enables flexible deployment across diverse product families, from consumer electronics to aerospace control modules. Users appreciate the straightforward installation—simply align the socket with the PCB footprint and apply gentle pressure to secure the connection—eliminating the need for additional tooling or adhesives. This ease of use reduces setup time, allowing teams to focus on diagnostic analysis and performance optimization.

Why Choose Us

Choosing the Yamaichi IC Test and Burn‑in Socket means selecting a solution backed by decades of expertise in electronic interconnect technology. Our manufacturing facilities adhere to ISO 9001 standards, and each batch is traceable through a comprehensive serial‑number system, providing full accountability and rapid support in the event of a field issue. The socket’s gold‑plated contacts are engineered to resist corrosion and maintain low contact resistance even after thousands of thermal cycles, delivering performance that rivals higher‑priced alternatives. We also offer a dedicated technical assistance team that can guide customers through integration challenges, offering schematic reviews, layout recommendations, and troubleshooting advice. In addition, our after‑sales service includes a 12‑month warranty covering material defects, reinforcing confidence in the long‑term reliability of the product. By partnering with us, customers gain access to a reliable supply chain, consistent product availability, and a commitment to continuous improvement driven by real‑world feedback.

Key Features

  • Precision 0.65 mm pitch ensures perfect alignment with QFP80 family packages
  • Gold‑plated contacts provide superior conductivity and corrosion resistance
  • Robust copper alloy body delivers high mechanical strength for repeated insertions
  • Low‑profile design minimizes board space while maintaining excellent thermal performance
  • Comprehensive technical support and 12‑month warranty for peace of mind

FAQ

What package types are compatible with this socket?

The socket is compatible with QFP80, TQFP80, FQFP80, and PQFP80 packages, covering a wide range of 0.65 mm pitch integrated circuits.

Can the socket withstand high‑temperature soldering processes?

Yes, the socket’s copper alloy construction and gold‑plated contacts are rated for typical reflow soldering temperatures up to 260 °C, making it suitable for both prototype and production soldering.

How many insertion cycles can the socket handle before performance degrades?

Our testing indicates the socket can endure over 5,000 insertion and removal cycles while maintaining low contact resistance, thanks to the durable material selection and precise manufacturing tolerances.

Is there a recommended method for cleaning the contacts after extended use?

We advise using a lint‑free swab lightly moistened with isopropyl alcohol to remove any residue, followed by a dry air blow to ensure the contacts are free of moisture before re‑installation.

What support is available if I encounter fitting issues?

Our technical support team can provide layout verification, dimensional checks, and on‑site assistance if needed. Contact us through the support portal for rapid response.

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