XYG Enplas OTS-8(20)-1.27-01 1.27mm Pitch 5.4mm SOP8 SOIC8 Test Socket

Description

Product Overview

The XYG Enplas OTS-8(20)-1.27-01 is a precision-engineered socket designed for the most demanding electronic testing and programming environments. Featuring a 1.27 mm pitch and a 5.4 mm width, this socket accommodates SOP8, SO8, and SOIC8 package integrated circuits with a secure, low‑resistance connection. The open‑top design allows effortless chip insertion and removal, reducing handling time and minimizing the risk of damage during repeated test cycles. Constructed from high‑temperature resistant alloy and plated with gold‑tone contacts, the socket ensures consistent electrical performance even under prolonged burn‑in conditions. Its compact footprint makes it suitable for both bench‑top test rigs and automated production lines, providing flexibility for a wide range of applications from prototype validation to high‑volume manufacturing.

Usage

This socket excels in environments where reliability and repeatability are critical. Engineers and technicians use it for MCU testing, firmware programming, and burn‑in verification in laboratories, R&D facilities, and production floors. The socket’s robust construction tolerates temperature fluctuations from -40 °C to +85 °C, making it ideal for thermal cycling tests. Its compatibility with standard test fixtures and programming adapters means it can be integrated into existing test setups without the need for custom tooling. Whether you are validating a new microcontroller design, performing stress tests on existing boards, or conducting high‑speed data acquisition, the OTS-8(20)-1.27-01 delivers consistent contact resistance and signal integrity, ensuring accurate results every time.

Why Choose Us

Choosing the XYG Enplas OTS-8 socket means selecting a product backed by decades of expertise in electronic interconnects. Each socket undergoes rigorous quality control, including automated contact resistance testing and visual inspection, to guarantee that every unit meets strict industry standards. The use of premium materials such as nickel‑silver alloy and gold‑tone plating provides superior corrosion resistance and longevity, reducing the need for frequent replacements. Additionally, XYG offers comprehensive technical support, including detailed datasheets, application notes, and a responsive engineering team ready to assist with integration challenges. Our commitment to continuous improvement ensures that you receive a product that not only meets but exceeds the expectations of modern electronic testing.

Key Features

• Precise 1.27 mm pitch and 5.4 mm width for reliable IC alignment
• Open‑top design enables quick chip insertion and removal, saving time
• Gold‑tone plated contacts deliver low resistance and excellent conductivity
• Durable nickel‑silver alloy body withstands high‑temperature burn‑in cycles
• Dedicated XYG technical support and after‑sales service for seamless integration

FAQ

What IC packages are compatible with this socket?

The OTS-8(20)-1.27-01 supports SOP8, SO8, and SOIC8 package types, covering a broad range of microcontrollers and logic devices.

Can this socket be used for high‑frequency signal testing?

Yes. The gold‑tone contacts and short signal path minimize parasitic inductance, making the socket suitable for high‑speed and high‑frequency applications.

Is the socket reusable after multiple insertions?

Absolutely. The robust construction and corrosion‑resistant plating allow for thousands of insertion cycles without degradation of performance.

What temperature range does the socket support?

The socket is rated for operation from –40 °C to +85 °C, ensuring reliable performance in both cold‑start and elevated‑temperature burn‑in environments.

Do you provide customization options for larger orders?

XYG offers customization services, including different pitch sizes, material finishes, and packaging options for bulk orders. Contact our sales team for details.