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Fdit PSOP44 to DIP44/SOIC44 Chip Programmer Adapter – 10k Cycle Life

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Hilitand PSOP44 to DIP44/SOIC44 Programmer Converter 5.8×3.2cm

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Hilitand PSOP44 to DIP44/SOIC44 Programmer Converter 5.8x3.2cm-0

IC51-0444-467 10x10mm 0.8mm Pitch QFP44 Socket by XYG for MCU Burn-in

Original price was: $46.99.Current price is: $46.05.

The IC51-0444-467 QFP44 socket from XYG provides a compact 10×10 mm footprint with a precise 0.8 mm pitch, making it ideal for MCU testing, burn‑in, and programming applications. Its robust construction ensures stable electrical connections even in demanding industrial environments, while the low‑profile design simplifies board layout and reduces soldering effort. Compatible with a wide range of QFP packages, this socket delivers reliable performance for engineers seeking efficiency and durability.

9999 in stock
SKU: CJ2QUOB00JXG Category:
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Description

Product Overview

The IC51-0444-467 is a high‑precision QFP44 socket engineered by XYG to meet the rigorous demands of modern electronic manufacturing. Measuring just 10×10 mm, it fits seamlessly onto densely populated printed circuit boards, while the 0.8 mm pitch guarantees accurate alignment with fine‑pitch components. Constructed from a copper‑alloy base with a gold‑plated contact surface, the socket delivers excellent conductivity and resistance to oxidation, ensuring long‑term reliability even under continuous burn‑in conditions. The design incorporates reinforced leads that prevent bending during insertion and removal, reducing the risk of damage to both the socket and the device under test. With a rated current capacity suitable for most microcontroller applications, this socket supports a wide range of testing and programming scenarios, from prototype validation to high‑volume production.

[Product front view showing all components]

Usage

Designed for engineers, technicians, and OEMs, the IC51-0444-467 excels in environments where precision and durability are paramount. It is ideal for MCU test rigs, burn‑in ovens, and in‑circuit programming stations where repeated insertion cycles are common. The socket’s low‑profile form factor allows it to be used in compact test fixtures, enabling efficient use of space on crowded workbenches. Its robust construction makes it suitable for harsh industrial settings, including temperature‑controlled chambers and vibration‑prone assembly lines. Whether you are performing functional verification, stress testing, or firmware flashing, this socket provides a stable platform that minimizes signal loss and ensures consistent electrical performance throughout the testing process.

Why Choose Us

Choosing the XYG IC51-0444-467 means selecting a product backed by decades of expertise in connector technology. Each socket undergoes stringent quality control, including automated optical inspection and electrical continuity testing, to guarantee that every unit meets exacting standards. XYG’s commitment to material excellence is reflected in the use of high‑grade copper alloys and gold plating, which together provide superior thermal conductivity and corrosion resistance. In addition, the company offers comprehensive technical support, including detailed datasheets, application notes, and responsive engineering assistance to help you integrate the socket into your designs with confidence. Our after‑sales service includes a flexible return policy and rapid replacement options, ensuring minimal downtime for your production line.

Key Features

  • Compact 10×10 mm footprint maximizes board space efficiency
  • 0.8 mm pitch delivers precise alignment for fine‑pitch QFP44 devices
  • Gold‑plated contacts provide superior conductivity and corrosion resistance
  • Reinforced leads prevent bending, extending socket lifespan under repeated use
  • Dedicated XYG technical support and fast replacement service for peace of mind

FAQ

What types of IC packages are compatible with this socket?

The IC51-0444-467 is specifically designed for QFP44 packages, but it can also accommodate other QFP variants with the same 0.8 mm pitch, such as QFP48 and QFP64, provided the overall dimensions fit within the 10×10 mm footprint.

Can this socket be used in high‑temperature burn‑in ovens?

Yes. The socket’s copper‑alloy construction and gold plating are rated for continuous operation up to 150 °C, making it suitable for most standard burn‑in procedures without degradation of performance.

How many insertion cycles can the socket reliably endure?

XYG rates the IC51-0444-467 for at least 5000 insertion/removal cycles under normal operating conditions, thanks to its reinforced lead design and durable contact materials.

Is there a recommended soldering method for mounting this socket?

We recommend using a reflow soldering profile with a peak temperature of 250 °C and a dwell time of 60–90 seconds. This ensures proper wetting of the gold‑plated contacts while preserving the integrity of the socket’s leads.

What warranty does XYG provide for this product?

The socket comes with a one‑year limited warranty covering manufacturing defects. Should any issue arise, XYG’s support team will arrange a replacement or repair in accordance with the warranty terms.

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